Researchers combine epoxy with a tough graphene foam and carbon nanotube scaffold to build a resilient composite that's tougher and as conductive as other compounds but as light as pure epoxy. Rice ...

Master Bond Polymer System EP21TDC-2AN is a two component flexible epoxy resin compound for high performance bonding, sealing, coating, and encapsulation. This system’s exceptional thermal ...

Toughened epoxy system EP21FL has a 4 to 1 mix ratio by weight and cures at ambient temperature. It has a low mixed viscosity of 2,000-4,500 cps. EP21FL has excellent electrical insulation properties ...

Master Bond has formulated a line of one component epoxy underfill compositions which feature rapid cures at moderately elevated temperatures and offer excellent underfill-to-die passivation as well ...

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide ...

Epoxy potting and encapsulation compounds protect electronic assemblies from many environmental factors such as water, harsh chemicals, physical damage, shock and vibration. Techsil supplies potting ...

The global supply of epoxy molding compound for backend applications has fallen short of demand by 20% with delivery lead times extended further, according to industry sources. Sumitomo Bakelite, now ...

Key semiconductor material distributor Chang Wah Electromaterials (CWE) has announced new pricing for epoxy molding compounds effective from the third quarter of 2024, due to a weak Japanese Yen. Some ...

Rice University scientists have built a better epoxy for electronic applications. Epoxy combined with "ultrastiff" graphene foam invented in the Rice lab of chemist James Tour is substantially tougher ...